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Supported built-in modules - List of Manufacturers, Suppliers, Companies and Products

Supported built-in modules Product List

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AIB-MX13/23

DeviceEdge Jetson Series

The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.

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AIB-MX11/12/21/22

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.

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AIE-KX11/12/21/22

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.

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VIA SOM-3000

The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.

The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.

  • Microcomputer
  • Embedded Board Computers

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AIE-KX13/23

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.

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